Manufacturer	Measurement Description
K.O. Lee Slicers (6" x 12")	Surface grinding, including matching layers and ceramics:
>>>>	Capable of holding close tolerances.
>>>>	Capable of reducing the material __thickness down to 0.002" in 1 micron __increments.
>>>>	Used for material sizes up to 4 " x 8".
K.O. Lee Grinder (6"x12"--6" wheels)	Vertical spindle grinding with cup wheels:
>>>>	Capable of holding very close tolerances __to ±2 microns.
>>>>	Capable of grinding anything that is __hard and difficult to grind -- such as __ceramics and alumina titanium carbide.
K.O. Lee Tool and Cutter Grinder	Cylindrical grinding:
>>>>	Used for special angles and wafer __reclaiming.
>>>>	Used for ceramics.
K.O Lee Slicer	Slicing:
>>>>	Auto-indexing
>>>>	Capable of holding tolerances to __± 0.002".

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